Etching solution H-200A
Main component: Aqueous solution of ferric chloride
Etching solution that allows for easy etching of self-made circuit boards.
- Company:サンハヤト
- Price:Other
1~8 item / All 8 items
Main component: Aqueous solution of ferric chloride
Etching solution that allows for easy etching of self-made circuit boards.
Main component: Ferric chloride aqueous solution
Etching solution that allows for easy etching of self-made circuit boards.
We etch Cu and Cu alloy films effectively. We offer solutions for standard thin film etching and bulk etching of Cu/Ti stacked films.
The features of this product are as follows: - It forms a good positive taper. - There is minimal side etching, allowing for the formation of fine patterns. - The etching speed and in-plane uniformity of the etching shape are excellent. Keywords: wet etching, copper
We will etch the Cr film well. If you are considering the formation of fine patterns, we also offer suggestions for pretreatment solutions to improve wettability.
The features of this product are as follows: - It has minimal side etching, allowing for the formation of fine patterns. - The etching speed and in-plane uniformity of the etching shape are excellent. - It is suitable for etching of black matrix (BM) and photo masks made of chromium. Keywords: wet etching, chromium
Main component: Ferric chloride aqueous solution
Etching solution that allows for easy etching of self-made circuit boards.
We will etch the W film well.
The features of this product are as follows: - It forms a good positive taper. - There is minimal side etching, allowing for the formation of fine patterns. - The etching speed and in-plane uniformity of the etching shape are good. - There are no residues after etching. Keywords: Wet etching, tungsten
We will etch the Au film well. There are also etching solutions for seed layers that cause little damage to the Au plating and allow for etching of the Au seed layer.
The features of this product are as follows: - It allows for processing at low temperatures and in a short time. - The etching speed and in-plane uniformity of the etching shape are excellent. - It is suitable for fine bump formation and pattern formation processes. Keywords: wet etching, gold, plating, seed layer, selective etching solution.
We etch TiW films effectively. Since the etching performance varies depending on the film formation method and film structure, please contact us for more details.
The features of this product are as follows: - It forms a good positive taper. - There is minimal side etching, allowing for the formation of fine patterns. - The etching speed and in-plane uniformity of the etching shape are excellent. - There is no residue after etching. Keywords: wet etching, titanium tungsten